DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD
Alignment | > 2.0 Cmk @ ± 12.5 μm (± 6 sigma) |
System alignment capability | > 2.0 Cmk @ ± 25 μm (± 6 sigma) |
Optimum core cycle time | 8 seconds |
Substrate size | 50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y) |
Operating System | Windows 7 Embedded |
Squeegee pressure mechanism | Software-controlled, motorized with closed loop feedback |
Stencil positioning | Semi-auto stencil load with drip tray |
Under stencil cleaning | Interchangeable under stencil cleaner (IUSC), fully programmable with wet/dry/vacuum wipe |
Adjustable-width stencil mount (AWSM) | Frame variants - fully adjustable to accommodate frame sizes in the range of 381 mm to 736 mm |
Substrate thickness | 0.2 mm to 6 mm |
Substrate weight (maximum) | 6 kg |
Substrate warpage | Substrate warpage |
Substrate fixture | Over the top clamp ,Edge clamp ,Foil-less clamp ,Vacuum |
Temperature & humidity sensor | Monitoring of the process environment |
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