MC Type |
KE-750 |
Placement head |
3 |
Placement speed |
0.25sec / chip (3 at the same time attached to the attached) |
Placement accuracy |
± 0.1mm chip ± 0.09mm QFP (Laser) |
Placement range |
1005 ~ 23.5mm (By Laser) |
PCB size |
Maximum: 330 * 250mm
|
PCB thickness |
0.4 ~ 4mm |
Patch speed |
8000 (grain / hour) |
PCB Dimensions |
L: 50.0 mm (min) -330.0 mm (max),
|
PCB thickness |
0.40mm (min) -4mm (max) |
Component placement range |
0402-48mm * 48mm (chip, sot, sop, melf, QFP, connector, sop, plcc) |
Component height |
0.3mm-10.5mm |
Component Dimensions |
0.5mm * 1.0mm (Min), 23.5mm * 23.5mm (Max) |
Mounting accuracy |
± 0.1mm (LA), ± 0.04mm (LAIC) |
Mounting Speed (Max) |
11,250 components / hour |
Angle accuracy |
0.001 degree |
Power supply |
single phase,2KW |
Appearance size |
1400 * 1440 * 1460 (including lights 2000mm) |
Weight |
1100KG |
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